About us

Lapmaster Wolters (Shenyang) Precision Machinery Co., Ltd. entered the Chinese market in 2005 as a wholly-owned subsidiary established by Lapmaster International Ltd, a globally renowned leader in the grinding and polishing industry. In May 2023, the company finalized a joint venture with Nanjing Xingong Group, becoming part of the "PSS" joint venture operations in China. Headquartered in Nanjing with manufacturing facilities in both Nanjing and Shenyang, the company has established a nationwide manufacturing and delivery network, dedicated to providing efficient and reliable processing solutions to customers across China and the Asia-Pacific region.

As a key business unit of the US-based Lapmaster International Group in China, Lapmaster-Wolters (Shenyang) Precision Machinery Co., Ltd. fully inherits the Group's accumulated technical expertise in precision lapping, polishing, and system integration. Since its inception in 1948, and building upon Lapmaster’s long-standing dedication to precision grinding technology, the Group has—starting in 2014—successively acquired a series of century-old German companies, including Peter Wolters, Micron, ELB, aba, Reform, and Kehren.

The company's business focuses on two core areas: the semiconductor sector and non-semiconductor industrial applications.

In the semiconductor sector, the company focuses on the R&D and manufacturing of precision grinding and polishing machine tools, providing customers with comprehensive service solutions and establishing a global collaborative R&D and service network. Since entering the Chinese market, the company has secured over 30 local patents, co-developed and localized 17 categories of key precision equipment, served 277 Chinese clients, and delivered more than 1,700 units, earning widespread market recognition. It also offers a suite of solutions tailored for third-generation semiconductor materials (such as silicon carbide/SiC wafers), including double-sided grinding and polishing equipment, single-sided thinning equipment, single-sided polishing equipment, and multi-wire sawing equipment. These products are widely used in the processing of 4- to 8-inch wafers, meeting the rigorous demands of semiconductor wafer manufacturing for high flatness, superior surface finish, and high production efficiency.

The company's flagship products include single- and double-sided lapping and polishing machines (ranging from 12" to 84") and DSG-series precision grinding machines. These systems are widely used across industries such as automotive and diesel engines, aerospace, hydraulics and sealing, semiconductors, technical ceramics, optical glass processing, and data storage, as well as in any sector requiring high-precision flat lapping and polishing of components.

Beyond the semiconductor sector, Remat-Walters also specializes in deburring machines and profile grinding machines. We further supply our customers with the necessary accessories, consumables, and precision monochromatic light inspection instruments. Our legacy of over 50 years of technical expertise and proven success underpins our commitment to high quality, a strong reputation, and excellent service; the goal of the Remat team is to set new standards in the fields of grinding, polishing, precision grinding, and honing in China.