- No. 3A-2, No. 8 Road, Shenyang Development Zone
Workpiece size: Maximum diameter 8 inches × 420 mm
·Optimized slurry cutting fluid management
·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
·Suitable for diverse applications with different specifications
Customized Solutions for the Semiconductor Industry.Our lapping, fine grinding, and polishing machines deliver leading advantages in both local and overall geometry of workpieces after processing.
The double-sided polishing machine can process workpieces up to 290 mm in diameter and 50 mm in thickness.
Description:Macro-SK Precision Grinding Center is specifically designed for machining stator inner cavities. It sets a new standard for efficiency and precision in stator inner cavity machining. The M
Lapmaster Wolters offers a full range of consumables for surface lapping, polishing, and inner hole surface processing, including traditional abrasives, diamond abrasives, polishing fluids, lapping pa
The SS-56H grinder is equipped with a 56-inch (1422 mm) diameter grinding disc. Made of HT300 gray cast iron, it complies with the ISO 185 (2005) standard. The grinding disc consists of multiple segme
The SS-56H grinding machine is equipped with a 56-inch (1422 mm) diameter grinding disc made of HT300 gray cast iron, compliant with ISO 185 (2005) standards. The grinding disc consists of multiple se
The SS-36H Lapping Machine, manufactured by Lapmaster Wolters Germany, is an ideal choice for factories requiring extremely high flatness and surface finish standards. It is equipped with a grooved la
The LAPMASTER WOLTERS AC 1000 Double-Side Machining Equipment is designed for batch finishing of workpieces. Featuring a modular design, the AC 1000 can be used for precision grinding, lapping, and po
The 24-inch Pneumatic Loading Lapping Machine is based on the 24-inch standard lapping machinePressure weights are connected to the cylinder connecting rod via self-aligning bearings.
