- No. 3A-2, No. 8 Road, Shenyang Development Zone
Workpiece size: Maximum diameter 8 inches × 420 mm
·Optimized slurry cutting fluid management
·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
·Suitable for diverse applications with different specifications
The company can manufacture lapping discs and polishing discs of complete sizes in materials such as ceramics, copper, glass, cast iron, and stainless steel, based on the workpiece material and proces
Customized Solutions for the Semiconductor Industry.Our lapping, fine grinding, and polishing machines deliver leading advantages in both local and overall geometry of workpieces after processing.
The "Macro" series adopts the innovative Moving-Wheel-Head (MWH) concept. All linear movements during positioning and precision grinding are achieved by the grinding head. Unlike traditional column mo
Manufactured by Lapmaster Wolters Germany, the AC1500 Double-Side Machining Equipment is designed for mass finishing of workpieces. Featuring a modular design, the AC1500 can be used for precision gri
To achieve double-side deburring in a single process, LAPMASTER WOLTERS has developed a new device, providing a patented solution for the Microline® AC 700.
The SS-48H grinding machine is equipped with a 48-inch (1219 mm) diameter grinding disc. Made of HT300 gray cast iron, it complies with the ISO 185 (2005) standard. The grinding disc consists of multi
The "Macro" series adopts the innovative Moving-Wheel-Head (MWH) concept. All linear movements during positioning and precision grinding are achieved by the grinding head. Unlike traditional column mo
The "Macro" series adopts the innovative Moving-Wheel-Head (MWH) concept. All linear movements during positioning and precision grinding are achieved by the grinding head. Unlike traditional column mo
Maximum workpiece size: 6 inches × 650 mm.Optimized design for mass production of 6-inch wafers
