- No. 3A-2, No. 8 Road, Shenyang Development Zone
Double-sided polishing machine
Capable of processing workpieces up to:
290 mm in diameter
50 mm in thickness
Lapmaster Wolters offers a full range of consumables for surface lapping, polishing, and inner hole surface processing, including traditional abrasives, diamond abrasives, polishing fluids, lapping pa
The linear surface processing equipment manufactured by Lapmaster Wolters' German branch provides diversified solutions for deburring technology and chamfering. The focus of processing is to improve t
Customized Solutions for the Semiconductor Industry.Our lapping, fine grinding, and polishing machines deliver leading advantages in both local and overall geometry of workpieces after processing.
The DDG580 is a high-precision and high-performance rotary through-feed grinding machine manufactured by LAPMASTER WOLTERS. It is capable of fulfilling the requirement of simultaneous grinding on both
Double-Sided Polishing Machine.It can process workpieces with a maximum diameter of 290mm and a maximum thickness of 50mm.
The company can manufacture lapping discs and polishing discs of complete sizes in materials such as ceramics, copper, glass, cast iron, and stainless steel, based on the workpiece material and proces
The LAPMASTER WOLTERS AC 1000 Double-Side Machining Equipment is designed for batch finishing of workpieces. Featuring a modular design, the AC 1000 can be used for precision grinding, lapping, and po
The Lapmaster DSG series double-side fine grinding machine is widely used for flat surface processing of workpieces, providing an excellent solution for the strict precision and tolerance requirements
Workpiece size: Maximum diameter 8 inches × 420 mm·Optimized slurry cutting fluid management·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
