- No. 3A-2, No. 8 Road, Shenyang Development Zone
Various materials and structural types of brushes are available according to customers' workpiece requirements.
High-quality diamond or Cubic Boron Nitride (CBN) precision grinding discs with various custom-shaped inserts are available to meet specific processing requirements. This series of precision grinding
Workpiece size: Maximum diameter 8 inches × 420 mm·Optimized slurry cutting fluid management·Recognized as the best-in-class for silicon carbide (SiC) and 8-inch semiconductor industries
Maximum workpiece size: 6 inches × 650 mm.Optimized design for mass production of 6-inch wafers
The linear surface processing equipment manufactured by Lapmaster Wolters' German branch provides diversified solutions for deburring technology and chamfering. The focus of processing is to improve t
The Lapmaster DSG series double-side fine grinding machine is widely used for flat surface processing of workpieces, providing an excellent solution for the strict precision and tolerance requirements
The LAPMASTER WOLTERS AC 2000 Double-Side Machining Equipment is designed for batch finishing of workpieces. Featuring a modular design, the AC 2000 can be used for precision grinding, lapping, and po
Customized Solutions for the Semiconductor Industry.Our lapping, fine grinding, and polishing machines deliver leading advantages in both local and overall geometry of workpieces after processing.
The LAPMASTER WOLTERS AC 1000 Double-Side Machining Equipment is designed for batch finishing of workpieces. Featuring a modular design, the AC 1000 can be used for precision grinding, lapping, and po
